Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier

ABSTRACT

To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

This is a divisional of application Ser. No. 09/716,289 filed on Nov.21, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of mounting a semiconductorchip which is suitable for manufacturing an electromagnetic wavereadable data carrier that functions as a flight tag, a label forphysical distribution management, a ticket for an unmanned wicket andothers, particularly relates to a method of mounting semiconductor chipin which a bare semiconductor chip can be mounted on a circuit board ata low cost by a flip-chip connecting method. The present invention alsorelates to a circuit board for flip-chip connection and a method ofmanufacturing the same. In addition, the present invention relates to anelectromagnetic wave readable data carrier and a method of manufacturingthe same, and an electronic component module for an electromagnetic wavereadable data carrier.

2. Description of the Related Art

For this type of electromagnetic wave readable data carrier, a flighttag disclosed in Japanese Patent Unexamined Publication No. Hei.6-243358 for example is known. It is estimated that the flight tag willbe used for the management of passenger's baggage at an airport as athrowaway tag in near future. At that time, in the case of a worldwideairline company, the enormous demand such as 8.5 million pieces permonth can be expected by only the company. Therefore, as to this type offlight tag, the establishment of mass production technology at anextremely low cost is desired.

The flight tag disclosed in the patent application is composed bymounting a curled conductive pattern to be an antenna coil and ICcomponents to be a send and receive circuit, a memory and others on thesingle side of a rectangular substrate made of a PET film.

The body of the flight tag that holds the curled conductive pattern tobe an antenna coil can be formed by selectively etching copper foil andaluminum foil respectively coated on the single side of the PET film byetching processing. Therefore, a continuous production line by roll toroll (RTR) can be readily realized by a resist formation process bywell-known photolithographic technology and the succeeding wet etchingprocess and others. In the meantime, circuit components such as a sendand receive circuit and a memory to be mounted on the body of the flighttag are integrated in one chip using semiconductor integrationtechnology.

These applicants propose that a bare semiconductor chip is first moduledby mounting the bare semiconductor chip composing the send and receivecircuit, the memory respectively described above and others on a thininsulating piece (a type of circuit board) and then the productivity ofa flight tag is enhanced by bonding the electronic component module on aPET film composing the body of the flight tag.

As for an electronic component mounted sheet, the advanced thinning ofwhich is requested, such as the electronic component module bonded tothe flight tag, a flip-chip connection method in which a baresemiconductor chip is directly mounted on a circuit board is oftenproposed.

An example of the flip-chip connection method (hereinafter called afirst related art type method) is shown in FIG. 14. In the first relatedart type method, a protruded terminal for connection (hereinafter calleda bump) b is formed on the bottom electrode (not shown) of asemiconductor chip a and after the bump b and an electrode area d of awiring pattern on a circuit board c are positioned, both are connectedvia joining material e such as solder and conductive paste.

In the first related art type method, a problem is pointed out such thatthe manufacturing cost is increased because (1) a process for supplyingand hardening the joining material e for connecting the bump b and theelectrode area d of the wiring pattern is complex, (2) an insulatingresin f called underfill is filled between the chip a and the board c soas to seal a bump connection portion between the bump b and theelectrode area d and thereby to acquire the reliability in themoisture-proof of the bump connected part and strength for mounting thesemiconductor chip and (3) a process for filling and hardening theinsulating resin f to be underfill is required.

Another example of the flip-chip connection method (a second related arttype method) is shown in FIG. 15. The second related art type method isproposed to solve the problem of the first related art type method and abare semiconductor chip is mounted on a circuit board using ananisotropic conductive sheet proposed in Japanese Patent No. 2586154.

In the second related art type method, an anisotropic conductive sheetgin which conductive particulates are dispersed in thermoplastic orthermosetting resin is put between a bare semiconductor chip a and acircuit board c, and the resin is made to flow by thermocompressionbonding, so that electric connection in the direction of the thicknessis acquired by conductive particulates h put between a bump b and anelectrode area d of the wiring pattern.

According to this method, there is effect that the positioning of thecircuit board with the wiring pattern when the semiconductor chip ismounted on the circuit board can be relatively roughly performed. Inaddition, time when resin is hardened is short, for example 10 to 20seconds, sealing material such as underfill is not required to be used,and the manufacturing cost can be reduced. To the contrary, problems arefurther pointed out such that (1) the anisotropic conductive sheet g isrelatively high-priced, (2) the anisotropic conductive sheet cannot beused for a board without heat resistance because the high temperature of200° C. or more is required for hardening the sheet, (3) it takes 10 to20 seconds to harden the resin though it is a relatively short time, andit is difficult to further simplify and speed up the process and (4) thereliability of connection is low because electric connection between thebump and the wiring pattern depends upon the contact of conductiveparticulates dispersed in the resin.

SUMMARY OF THE INVENTION

The invention is made to solve the problems in the related art typeflip-chip connection method and the object is to provide a method ofmounting semiconductor chip by a flip-chip connection method in which asemiconductor chip can be mounted on a circuit board promptly,electrically and mechanically securely and further at a low cost.

Also, another object of the invention is to provide a circuit board forflip-chip connection suitable for the above-mentioned mounting method.

Also, further another object of the invention is to provide a method ofmanufacturing a circuit board for flip-chip connection in which theabove-mentioned circuit board can be manufactured simply and at a lowcost.

Further, furthermore another object of the invention is to provide anelectromagnetic wave readable data carrier and a method of manufacturingthe same in which an electromagnetic wave readable data carrier thatfunctions as a flight tag, a label for physical distribution management,a ticket for an unmanned wicket and others can be produced at a low costin a mass.

Also, further another object of the invention is to provide anelectronic component module for an electromagnetic wave readable datacarrier.

The person skilled in the art will easily understand further anotherobject and the effect of the invention by referring to the descriptionof embodiments and others.

A method of mounting a semiconductor chip according to the invention isprovided with a process for pushing a melted thermoplastic resin coataside by pressing a bump of a bare semiconductor chip on the meltedthermoplastic resin coat applying an ultrasonic wave in a state in whichthe thermoplastic resin coat covering an electrode area on a wiringpattern is heated and melted and touching the bump and the electrodearea, a process for bonding the bump and the electrode area bycontinuously applying an ultrasonic wave in a state in which the bumpand the electrode area are touched and a process for cooling andsolidifying the melted thermoplastic resin and bonding the body of thebare semiconductor chip on a circuit board.

As clear from the description that in a state in which the thermoplasticresin coat covering an electrode area on a wiring pattern is heated andmelted, a thermoplastic resin coat is formed beforehand in an electrodearea on a wiring pattern of a circuit board used in the invention. Thiscoat may also cover only an electrode area of a wiring pattern and mayalso cover the overall surface of a wiring pattern.

Also, a phrase, an electrode area on a wiring pattern described abovemeans a fixed small area on a wiring pattern including a position for aterminal of an electronic component and others to be connected. In thiselectrode area, a part generally called a land and others on the wiringpattern is included.

Also, words, “heated and melted” mean both a state that thethermoplastic resin coat is heated and melted and a state that it isheated and softened to some extent. Further, it is desirable thatthermoplastic resin described above has a satisfactory characteristic asan adhesive.

According to such configuration, action and effect are acquired that (1)secure electric conduction is acquired because the junction of the bumpand the electrode area is diffused junction by an ultrasonic wave, (2)moisture-proof is satisfactory because the junction is sealed withresin, (3) mechanical mounting strength to pulling and others is highbecause the semiconductor chip and the circuit board are bonded when thethermoplastic resin is hardened, (4) electric conduction and mechanicalbonding are simultaneously enabled in a short time, (5) themanufacturing cost is low because a process for special sealing andbonding and bonding material are not required and (6) the surface of theboard is never more sticky than required in heating because nothermoplastic resin coat exists in a part in which the surface of theboard is exposed.

Also, the overall surface of the wiring pattern of the circuit board forflip-chip connection according to the invention is covered with athermoplastic resin coat.

According to such configuration, as the overall surface of the wiringpattern is covered with a thermoplastic resin coat in case the circuitboard described above is used for the mounting method described above,sealed structure satisfactory in moisture-proof and bonded structurehigh in tensile strength are acquired.

Also, in a method of manufacturing the circuit board for flip-chipconnection according to the invention, for an etching mask used when thewiring pattern is formed by etching processing, thermoplastic resin isused.

According to such configuration, as an etching mask used in etchingprocessing for forming the wiring pattern is used for the thermoplasticresin coat covering the overall surface of a conductive pattern as itis, a special coat formation process is not required and much labor isnot required, and therefore the manufacture at a low cost can berealized.

Also, in a method of manufacturing an electromagnetic wave readable datacarrier according to the invention, the body of a data carrier in whicha curled conductive pattern composing an antenna coil is held on thin orsheet insulating base material and an electronic component module inwhich a bare semiconductor chip composing a send and receive circuit, amemory and others is mounted on a wiring pattern of a thin or sheetcircuit board are integrated.

In the data carrier manufacturing method, a process for manufacturingthe electronic component module in which the bare semiconductor chip ismounted on the wiring pattern of the thin or sheet circuit board ismainly characteristic.

That is, in the process for manufacturing the electronic componentmodule, a subprocess for pushing a melted thermoplastic resin coat asideby pressing a bump of the bare semiconductor chip on the meltedthermoplastic resin coat applying an ultrasonic wave in a state in whichthe thermoplastic resin coat covering the electrode area on the wiringpattern is heated and melted and touching the bump and an electrodearea, a subprocess for bonding the bump and the electrode area bycontinuously applying an ultrasonic wave in a state in which the bumpand the electrode area are touched and a subprocess for cooling andsolidifying the melted thermoplastic resin and bonding the body of thebare semiconductor chip on the circuit board are included.

According to such configuration, the electromagnetic wave readable datacarrier that functions as a flight tag, a label for physicaldistribution management, a ticket for an unmanned wicket and others canbe produced at a low cost in a mass owing to action and effect that (1)secure electric conduction is acquired because the junction of the bumpand the electrode area is diffused junction by an ultrasonic wave, (2)moisture-proof is satisfactory because the junction is sealed withresin, (3) mechanical mounting strength to pulling and others is highbecause the semiconductor chip and the circuit board are bonded when thethermoplastic resin is hardened, (4) electric conduction and mechanicalbonding are simultaneously enabled in a short time, (5) themanufacturing cost is low because a process for special sealing andbonding and bonding material are not required and (6) the surface of theboard is never more sticky than required in heating because nothermoplastic resin coat exists in a part in which the surface of theboard is exposed.

Also, the overall surface of a wiring pattern of a circuit board used inthe manufacturing process of the electronic component module accordingto the invention is covered with a thermoplastic resin coat.

According to such configuration, as the overall surface of the wiringpattern is covered with the thermoplastic resin coat in case theabove-mentioned circuit board is used in the electronic component modulemanufacturing process, sealed structure satisfactory in moisture-proofand bonded structure high in tensile strength are acquired.

Also, in a circuit board manufacturing method according to theinvention, thermoplastic resin is used as an etching mask used when awiring pattern is formed by etching processing.

According to such configuration, as the etching mask used in the etchingprocessing for forming the wiring pattern becomes a thermoplastic resincoat covering the overall surface of a conductive pattern as it is, aspecial coat formation process is not required and much labor is notrequired, and therefore the manufacture at a low cost can be realized.

Also, in a method of manufacturing an electromagnetic wave readable datacarrier according to the invention, the body of a data carrier in whicha metallic foil pattern composing an antenna coil is held on thin resinbase material, and an electronic component module in which a baresemiconductor chip composing a send and receive circuit, a memory andothers is mounted on a aluminum foil wiring pattern on the surface ofthin resin base material are integrated.

In the electromagnetic wave readable data carrier manufacturing method,a process for manufacturing the electronic component module in which thebare semiconductor chip is mounted on the aluminum foil wiring patternon the surface of the thin resin base material is mainly characteristic.

That is, in the process for manufacturing the electronic componentmodule, a subprocess for pushing a melted thermoplastic resin coat asideby pressing a bump of the bare semiconductor chip on the meltedthermoplastic resin coat applying an ultrasonic wave in a state in whichthe thermoplastic resin coat covering an electrode area on the aluminumfoil wiring pattern is heated and melted and touching the bump and theelectrode area, a subprocess for bonding the bump and the electrode areaby continuously applying an ultrasonic wave in a state in which the bumpand the electrode area are touched and a subprocess for cooling andsolidifying the melted thermoplastic resin and bonding the body of thebare semiconductor chip on the circuit board are included.

Also, the overall surface of the aluminum foil wiring pattern of thecircuit board according to the invention is covered with a thermoplasticresin coat.

Also, in the circuit board manufacturing method according to theinvention, thermoplastic resin is used as an etching mask used when thealuminum foil wiring pattern is formed by etching processing.

In a preferred embodiment of the invention, for thermoplastic rein,polyolefin resin or polyester resin is used.

Action and effect can be desired by using such resin such that theresistance to a chemical satisfactory for an etching mask, andsatisfactory junction strength between a metallic bump on the side ofthe semiconductor chip and a metallic electrode area on the side of thewiring pattern are acquired. That is, polyolefin resin is provided withsatisfactory resistance to alkaline etchant such as NaOH or polyesterresin is provided with satisfactory resistance to acid etchant such asFeCl₂. In addition, these resins are also excellent in an adhesiveproperty.

Further, an electronic component module for an electromagnetic wavereadable data carrier, according to the invention, comprises: a circuitboard having a wiring pattern with an electrode area and a thermoplasticresin coat covering the electrode area of the wiring pattern; and asemiconductor chip mounted on the circuit board, said semiconductor chiphaving a bump at a side of the circuit board thereof. The bump of thesemiconductor chip penetrates the thermoplastic resin coat and directlybonds with the electrode area of the wiring pattern.

In addition, an electromagnetic wave readable data carrier, according tothe invention, comprises: a body of a data carrier including aninsulating base material and a conductive pattern held on the insulatingbase material; and an electronic component module including a circuitboard and a semiconductor chip mounted on the circuit board, saidcircuit board having a wiring pattern with an electrode area and athermoplastic resin coat covering the electrode area of the wiringpattern, said semiconductor chip having a bump at a side of the circuitboard thereof, the bump of the semiconductor chip penetrating thethermoplastic resin coat and directly bonding with the electrode area ofthe wiring pattern, wherein said electronic component module ismanufactured by a method comprising: heating and melting thethermoplastic resin coat of said circuit board; pressing the bump ofsaid semiconductor chip on the thus melted thermoplastic resin coatwhile applying an ultrasonic wave to the bump so that the bumppenetrates the melted thermoplastic resin coat and brings into contactwith electrode area; bonding the bump and the electrode area bycontinuously applying the ultrasonic wave to the bump bringing intocontacted with the electrode area; and cooling and solidifying themelted thermoplastic resin coat so as to securely mount saidsemiconductor chip on said circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-E are respectively process drawings for explaining a mountingmethod according to the invention;

FIGS. 2A-C are respectively explanatory drawings showing the details ofan ultrasonic mounting process;

FIG. 3 is a sectional view showing mounted structure by a methodaccording to the invention;

FIG. 4 is a table showing the bonding strength of a semiconductor chipand a wiring pattern;

FIG. 5 is a front view showing an example of a data carrier;

FIG. 6 is a sectional view showing a lamination of the body of the datacarrier and an electronic component module;

FIGS. 7A-E are respectively process drawings showing the manufacturingprocess of the body of the data carrier;

FIGS. 8A-E are respectively process drawings showing the manufacturingprocess of the electronic component module;

FIGS. 9A-B are respectively process drawings showing processes formounting the electronic component module on the body of the datacarrier;

FIGS. 10A-C respectively show the manufacturing process of the body ofthe data carrier;

FIGS. 11A-E respectively show the manufacturing process of theelectronic component module;

FIGS. 12A-B are respectively process drawings showing a process formounting the electronic component module on the body of the datacarrier;

FIG. 13 is a table showing the result of the moisture-proof test of thethin data carrier to which the invention is applied;

FIG. 14 shows a first related art type method of flip-chip connection;and

FIG. 15 shows a second related art type method of flip-chip connection.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to the attached drawings, a suitable embodiment of asemiconductor chip mounting method according to the invention will bedescribed in detail below.

As described above, the semiconductor chip mounting method according tothe invention is provided with: 1) a process for pushing a heated andmelted thermoplastic resin coat covering an electrode area on a wiringpattern aside by pressing a bump of a bare semiconductor chip on themelted thermoplastic resin coat applying an ultrasonic wave so as tobring the bump into contact with the electrode area; 2) a process forbonding the bump and the electrode area by continuously applying anultrasonic wave in a state in which the bump and the electrode area arein contact; and 3) a process for cooling and solidifying the meltedthermoplastic resin and bonding the body of the bare semiconductor chipon a circuit board.

An outline of a series of processes including such a mounting method isshown in a process drawing shown in FIGS. 1A-E. In this series ofprocesses, a metallic foil lamination manufacturing process (A), anetching mask printing process (B), an etching process for forming awiring pattern (C), an ultrasonic mounting process (D) and a bondingprocess (E) are included. The details of the processes will be describedin order below.

[Metallic Foil Lamination Manufacturing Process (A)]

In this process, an Al-PET lamination 1 which is original material of athin circuit board is manufactured. For example, the Al-PET lamination 1is manufactured in a process for laminating hard aluminum foil 3 havingthe thickness of 35 μm on the single side (the upper surface in FIG. 1A)of a PET film 2 having the thickness of 25 μm via an urethane adhesive,and bonding them thermally under a condition of the temperature of 150°C. and the pressure of 5 kg/cm².

[Etching Mask Printing Process (B)]

In this process, an etching resist pattern 4 in the shape of a requiredwiring pattern is formed on the surface of the hard aluminum foil 3 ofthe Al-PET lamination 1. For example, the resist pattern 4 is formed byapplying a polyolefin thermoplastic resin adhesive, which is melted atthe temperature of approximately 150° C., on the surface of the hardaluminum foil 3 by approximately 4 to 6 μm in thickness by a method suchas gravure. It is desirable that this thickness is varied according tothe size and the shape of a bump of a mounted bare chip.

[Etching Process (C)]

In this process, a wiring pattern 6 composed of the hard aluminum foil 3is formed by removing an aluminum foil part 5 exposed from the etchingresist pattern 4 by well-known etching process. For example, the wiringpattern 6 is formed by exposing the aluminum foil part 5 exposed fromthe etching resist pattern 4 to NaOH (120 g/l) used as etchant under acondition of the temperature of 50° C. The wiring pattern 6 composed ofthe hard aluminum foil 3 appears on the surface of a circuit board 7acquired in this etching process. The overall surface of the wiringpattern 6 is covered with the polyolefin thermoplastic resin adhesiveused for the etching resist pattern (an etching mask) 4. In other words,the surface of at least an electrode area (an area to be connected witha bump of a bare semiconductor chip described later) of the wiringpattern 6 is covered with a thermoplastic resin coat 4 a.

[Ultrasonic Mounting Process (D)]

In this process, a bare semiconductor chip 8 is mounted on the circuitboard 7 applying an ultrasonic wave. This process includes: 1) asubprocess (a first subprocess) for pushing the melted thermoplasticresin coat 4 a aside by pressing a bump 9 of the bare semiconductor chip8 on the melted thermoplastic resin coat 4 a in a state in which thethermoplastic resin coat 4 a covering an electrode area 10 on the wiringpattern 6 is heated and melted applying an ultrasonic wave so as tobring the bump 9 into contact with the electrode area 10 ; and 2) asubprocess (a second subprocess) for bonding the bump 9 and theelectrode area 10 in a state in which the bump 9 and the electrode area10 are contacted with each other by continuously applying an ultrasonicwave.

The bare semiconductor chip 8 is composed as a so-called surfacemounting-type component. That is, the bare semiconductor chip 8 has abody which has 150 μm thick and the bump 9 which is a metallic terminalfor connection and protruded from the bottom of the bare semiconductorchip 8. In the first subprocess, the bump (made of gold for example) 9is pressed on the thermoplastic resin coat 4 a which is melted byheating at 150° C. in a state in which an ultrasonic wave is applied.Then, the melted thermoplastic resin coat 4 a is pushed aside andremoved from the position of the end of the bump 9 by the ultrasonicvibration of the bump 9. Further, an oxide layer and others on thesurface of the aluminum foil wiring pattern 6 are also mechanicallyremoved by the vibration. As a result, the bump 9 and the electrode area10 are contacted with each other. In the second subprocess, afterward,the bump 9 and the electrode area 10 of the wiring pattern 6 are furtherheated by frictional heat by the vibration, a metallic fused part inwhich atoms of gold are diffused in the aluminum foil is formed and thebonding of both by an ultrasonic wave is completed.

The first and second subprocesses are completed by applying ultrasonicvibration of the frequency of 63 kHz by approximately a few secondsunder the pressure of 0.2 kg/mm² for example after the baresemiconductor chip 8 is arranged in a predetermined position.

The details of the ultrasonic mounting process are shown in a processdrawing shown in FIGS. 2A-C. In a positioning process shown in FIG. 2A,in a state in which an ultrasonic horn 11 and an anvil 12 used as aheater table respectively provided with a vacuum attraction function arearranged opposite, the bare chip 8 is attracted to the ultrasonic horn11 as shown by an arrow 11 a and the circuit board 7 is attracted to theanvil 12 as shown by an arrow 12 a. In this state, the bump 9 on theside of the bare chip 8 and the electrode area 10 of the wiring pattern6 on the side of the circuit board 7 are positioned, relatively movingthe ultrasonic horn 11 and the anvil 12 in a horizontal direction.Simultaneously, the circuit board 7 is heated up to 150° C. by the anvil12.

In a process for removing the thermoplastic resin adhesive shown in FIG.2B, the melted thermoplastic resin coat 4 a is pushed aside by pressingthe bump 9 of the bare chip 8 on the thermoplastic resin adhesive (thethermoplastic resin coat) 4 a in a heated and melted state by applyingpressure (0.1 to 0.3 kgf) as shown by an arrow P, as applying ultrasonicvibration (63.5 kHz, 2 W) as shown by an arrow v by the ultrasonic horn11 and the anvil 12. Therefore, the bump 9 and the electrode area 10 arecontacted with each other.

In an ultrasonic bonding process shown in FIG. 2C, diffused junctionbetween metals is accelerated by further continuously applyingultrasonic vibration v, and the bump 9 and the electrode area 10 arebonded.

Referring to FIGS. 1A-E again, the description will be continued.

[Bonding Process (E)]

In this process, the melted thermoplastic resin coat 4 a is hardenedagain by natural cooling or forced cooling by removing the heat of 150°C. applied to the circuit board. Therefore, the bare semiconductor chip8 and the wiring pattern 6 are bonded. That is, the thermoplastic resincoat 4 a in a melted state filled between the bottom of the baresemiconductor chip 8 and the circuit board 7 is cooled and solidified,and the bare semiconductor chip 8 and the circuit board 7 are firmlybonded and fixed.

The mounted structure completed in the processes (A) to (E) is shown inFIG. 3. As shown in FIG. 3, according to this mounted structure, actionand effect are acquired such that (1) sure electric conduction isacquired because the bump 9 and the electrode area 10 are bonded bydiffused junction by an ultrasonic wave, (2) the moisture-proof issatisfactory because a junction between the bump 9 and the electrodearea 10 is sealed with resin, (3) the mechanical strength of mountingfor pulling and others is high because the semiconductor chip 8 and thecircuit board 7 are bonded when the thermoplastic resin coat 4 a ishardened, (4) electric conduction and mechanical coupling aresimultaneously enabled in a short time, (5) the manufacturing cost isparticularly low because special processes from sealing to bonding andadhesive material are not required and (6) the surface of the board isnevermore sticky than required in heating because no thermoplastic resincoat exists in a part in which the surface of the board is exposed.

The strength of bonding between the bare semiconductor chip 8 and thewiring pattern 6 in the case of the mounting method using the resin coatin this embodiment is shown in FIG. 4 in comparison with a case usingonly ultrasonic bonding. As clear from FIG. 4, in the case of themounting method according to the invention, the double to triplestrength of bonding is acquired, compared with the case of onlyultrasonic bonding. It need scarcely be said that this is because thesemiconductor chip 8 and the circuit board 7 are bonded when thethermoplastic resin coat 4 a is hardened.

In the embodiment, the PET film 2 is used for resin base materialcomposing the lamination 1, however, a polyimide film and others can bealso used in place of the PET film.

Also, for the material of the etching resist pattern 4, polyesterthermoplastic resin can be also used in place of the polyolefin resin.However, in that case, FeCl₂ is used for etchant.

For the circuit board 7 shown in FIG. 1C, the overall surface of thewiring pattern 6 is covered with the thermoplastic resin coat 4 a andthe circuit board can be generalized as a circuit board for flip-chipconnection.

According to such configuration, as the overall surface of the wiringpattern 6 is covered with the thermoplastic resin coat 4 a in case thecircuit board is used for the above mounting method, sealed structuresatisfactory in moisture-proof and bonded structure high in tensilestrength are acquired. That is, the thermoplastic resin coat 4 a locatedin the vicinity of the electrode area 10 on the wiring pattern 6 mainlycontributes to sealing the ultrasonic junction, while the thermoplasticresin coat 4 a located in a part except the electrode area contributesto the bonding of the body of the semiconductor chip 8 and the circuitboard 7.

Also, in the circuit board manufacturing method shown in FIGS. 1B and1C, thermoplastic resin is used for an etching mask used when the wiringpattern is formed by etching processing and the circuit boardmanufacturing method can be generalized as a method of manufacturing acircuit board for flip-chip connection.

According to such configuration, as the material of the etching maskused in etching processing for forming the wiring pattern becomes thethermoplastic resin coat covering the overall surface of a conductivepattern as it is, a coat formation process is not required and labor isnot required. Therefore the manufacture at a low cost is realized.

Finally, the action and the effect of the semiconductor chip mountingmethod in this embodiment will be described together. That is, accordingto the above-mentioned mounting method,

(1) in the wiring pattern formation process, the insulating resist usedfor etching processing is not required to be peeled in another processand the cost can be reduced.

(2) Further, the insulating resist made of thermoplastic resin functionsas an adhesive immediately under the semiconductor chip and the strengthfor mounting the semiconductor chip by an ultrasonic wave can bereinforced.

(3) Also, the periphery of the bump can be sealed with resin materialand the reliability in moisture-proof of the bump connection can beenhanced.

(4) The resin material for the above-mentioned purpose required in arelated art type method is not required and the cost of the material canbe reduced.

(5) Secure connection between terminals is acquired by the diffusedjunction by ultrasonic vibration of metal between the bump and thewiring pattern.

(6) The ultrasonic junction, the melting of the thermoplastic resin andthe hardening of the thermoplastic resin can be executed within 1 to 2seconds and the manufacturing time can be reduced.

Next, referring to FIGS. 5 to 10C, an embodiment of a data carriermanufacturing method according to the invention will be described. Thisdata carrier functions as a flight tag, a label for physicaldistribution management, a ticket for an unmanned wicket and others andcan read an electromagnetic wave. This data carrier is composed byintegrating the body of the data carrier with an electronic component.In the body of the data carrier, a metallic foil pattern composing anantenna coil is held on thin resin base material. In the electroniccomponent module, a bare semiconductor chip composing a send and receivecircuit, a memory and others is mounted on an aluminum foil wiringpattern on the surface of the thin resin base material.

An example of the embodiment of the data carrier is shown in FIG. 5. Asshown in FIG. 5, the data carrier DC is provided with the body of thedata carrier 100 and an electronic component module 200. In the body ofthe data carrier 100, a copper foil curled conductive pattern(equivalent to an antenna coil) 102 having the thickness of 10 μm isheld on the single side of polyethylene terephthalate (PET) basematerial 101 having the thickness of 25 μm. In the electronic componentmodule 200, bare chip IC 202 is mounted on the lower side in FIG. 5 of aglass epoxy piece 201 having the thickness of 70 μm. The electroniccomponent module 200 is mounted on the body of the data carrier 100 sothat the piece 201 crosses an orbital conductive flux 102 a composingthe curled conductive pattern 102. Electric connection of the electroniccomponent module 200 with the curled conductive pattern 102 is performedin a terminal pad on the inner side 103 and in a terminal pad on theouter side 104 of the curled conductive pattern 102.

An example of the structure in which the electronic component module 200is mounted is shown in an enlarged sectional view in FIG. 6. A method ofmanufacturing the body of the data carrier 100 and the electroniccomponent module 200 respectively shown in FIGS. 5 and 6 will besequentially described in detail below.

An example of the manufacturing process of the curled conductive pattern102 composing an antenna coil is shown in FIGS. 7A-E. Referring to FIGS.7A-E, a process when the curled conductive pattern 102 to be an antennacoil is formed on the single side of the PET film base material 101 willbe described.

(Process A as Shown in FIG. 7A)

First, a Cu-PET lamination 301 is prepared. For example, copper foil 303having the thickness of 10 μm is laminated on the single side of a PETfilm 302 having the thickness of 25 μm via an urethane adhesive. Thenthey is thermically bonded under a condition of the temperature of 150°C. and the pressure of 5 kg/cm². Hereby, the Cu-PET lamination 301 inwhich the cupper foil 303 is bonded on the surface of the PET film 302is completed.

(Process B as Shown in FIG. 7B)

Next, a curled etching resist pattern 304 is formed on the surface ofthe copper foil 303 of the Cu-PET lamination 301. That is, insulatingetching resist ink is printed on the copper foil 303 using an offsetprinting method for example so that the insulating etching resist inkhas a curled shape having the number of turns, the width, the pitch andthe inside and outside circumferences for acquiring an L value and a Qvalue respectively required for the characteristics of a coil. For theresist ink at this time, a type hardened by heat or an active energybeam is used. For the active energy beam, ultraviolet rays or anelectron beam is used. In case ultraviolet rays are used, the resist inkincluding a photopolymerization agent and is used.

(Process C as Shown in FIG. 7C)

Next, conductive etching resist patterns 305 a and 305 b (103 and 104 inFIG. 5) in the shape of a required electrode are formed by conductiveink in a position for electric connection with the electrode of theelectronic component module 200 on the surface of the copper foil 303 ofthe Cu-PET lamination 301. These resist patterns 305 a and 305 b areformed by offset printing as in the above-mentioned process. For resistink, a thermosetting conductive adhesive hardened by heat treatment at120° C. for approximately 20 minutes is used. A screen printing methodgenerally performed may be also used for the printing of conductive inkin this process. For ink material, a chemical acquired by adding aphotopolymerization agent to the mixture of Ag particles and anthermoplastic adhesive for example or solder paste and others may bealso used.

(Process D as Shown in FIG. 7D)

Next, a copper foil part 306 exposed from the etching resist patterns304, 305 a and 305 b is removed by executing well-known etching and acurled conductive pattern (102 in FIG. 5) to be an antenna coil isformed. In this etching processing, FeCl₂ (120 g/l) is used for etchantunder a condition of the temperature of 50° C. and the copper foil 303is removed. Afterward, generally, unless the etching resist formed inthe process B is removed, an electronic component cannot be mounted on acircuit, that is, on a curled pattern composing an antenna coil. In thepresent invention, however, as described in relation to the process C,the conductive resist patterns 305 a and 305 b are provided and etchingresist is not required to be removed by mounting an electronic componentin this position. That is, a process for peeling the etching resist canbe omitted by the invention. Further, there is also effect that theetching resist 304 formed by insulating ink also functions as aninsulating protective layer on the surface of the copper foil circuitpattern.

(Process E as Shown in FIG. 7E)

Finally, in this embodiment, a transparent hole 307 into which a convexportion(a potting part 411) described later of the electronic componentmodule can be inserted is formed by a press process. As a result, thebody of the data carrier 100 in which the curled conductive pattern 308(102) to be an antenna coil is held on the single side of the PET filmbase material 302 (101) is completed.

Next, an example of the manufacturing process of the electroniccomponent module 200 is shown in FIGS. 8A-E. The contents shown in FIGS.8A-E are the same as the contents described above referring to FIGS.1A-E except that a bare chip 408 is sealed with resin in the pottingpart 411 in a final process and conductive resist 412 is arranged in anelectrode part for connection with the body of the data carrier 100.

[Metallic Foil Lamination Manufacturing Process (A)]

In this process, an Al-PET lamination 401 which is the base material ofa thin circuit board is manufactured. For example, the Al-PET lamination401 is manufactured in a process for laminating hard aluminum foil 403having the thickness of 35 μm on the single side (the upper surface inFIG. 8A) of a PET film 402 having the thickness of 25 μm via an urethaneadhesive and thermically bonding them under a condition of thetemperature of 150° C. and the pressure of 5 kg/cm².

[Etching Mask Printing Process (B)]

In this process, an etching resist pattern 404 in the shape of arequired wiring pattern is formed on the surface of the hard aluminumfoil 403 of the Al-PET lamination 401. For example, the resist pattern404 is formed by applying a polyolefin thermoplastic resin adhesive,which is melted at the temperature of approximately 150° C., on thesurface of the hard aluminum foil 403 by approximately 4 to 6 μm inthickness by a method such as gravure. It is desirable that the appliedthickness is adjusted according to the size and the shape of a bump ofamounted bare chip. In addition, in this process, conductive etchingresist patterns 412 a and 412 b in the shape of a required electrodepattern are arranged in each connection with terminal pads 305 a and 305b of the body of the data carrier 100. These resist patterns 412 a and412 b are formed by offset printing as in the above-mentioned process.For resist ink, a thermosetting conductive adhesive hardened by heattreatment at 120° C. for approximately 20 minutes is used. For theprinting of conductive ink in this process, screen printing generallyperformed may be also used. For ink material, a chemical in which aphoto polymerization agent is added to the mixture of Ag particles andan thermoplastic adhesive for example or solder paste and others may bealso used.

[Etching Process (C)]

In this process, a wiring pattern 406 made of hard aluminum foil 403 isformed by removing an aluminum foil part 405 exposed from the etchingresist pattern 404 by well-known etching processing. For example, thiswiring pattern 406 is formed by exposing the aluminum foil part 405exposed from the etching resist pattern 404 to NaOH (120 g/l) which isetchant under a condition of the temperature of 50° C. The wiringpattern 406 made of hard aluminum foil 403 appears on the surface of acircuit board 407 acquired in this etching process. Also, the overallsurface of the wiring pattern 406 is covered with the polyolefinthermoplastic resin adhesive used for the etching resist pattern (anetching mask) 404. In other words, the surface of at least the electrodearea (an area to be connected with the bump of the bare semiconductorchip described later) of this wiring pattern 406 is covered with athermoplastic resin coat 404 a.

[Ultrasonic Mounting Process (D)]

In this process, the bare semiconductor chip 408 is mounted on thecircuit board 407 applying an ultrasonic wave. This process includes: 1)a first subprocess for pushing the melted thermoplastic resin coat 404 aaside by pressing a bump 409 of the bare semiconductor chip 408 on themelted thermoplastic resin coat 404 a applying an ultrasonic wave in astate in which the thermoplastic resin coat 404 a covering an electrodearea 410 on the wiring pattern 406 is heated and melted so as to bringthe bump 409 into contact with the electrode area 410 and 2) a secondsubprocess for bonding the bump 409 and the electrode area 410 bycontinuously applying an ultrasonic wave in a state in which the bump409 and the electrode area 410 are contacted with each other.

The bare semiconductor chip 408 is composed as a so-called surfacemounting-type component. That is, the bare semiconductor chip 408 has abody which is 150 μm thick and the bump 409 which is a metallic terminalfor connection and protruded form the bottom of the bare semiconductor408. In the first subprocess, the bump (made of gold for example) 409 ispressed on the thermoplastic resin coat 404 a which is melted by heatingat 150° C. applying ultrasonic vibration. Then, the melted thermoplasticresin coat 404 a is pushed aside and removed from the end position ofthe bump 409 by the ultrasonic vibration of the bump 409. Further, anoxide layer and others on the surface of the aluminum foil wiringpattern 406 are also mechanically removed by the vibration. As a result,the bump 409 and the electrode area 410 are contacted with each other.In the second subprocess, afterward, the bump 409 and the electrode area410 of the wiring pattern 406 are heated by frictional heat by thevibration further, a metallic fused part in which atoms of gold arediffused in the aluminum foil is formed and the ultrasonic junction ofboth is completed.

The first and second subprocesses are completed by applying ultrasonicvibration at the frequency of 63 kHz for approximately a few secondsunder the pressure of 0.2 kg/mm² for example after the baresemiconductor chip 408 is arranged in a predetermined position.

[Bonding Process (E)]

In this process, the melted thermoplastic resin coat 404 a is rehardenedby natural cooling or forced cooling by removing the heat of 150° C.applied to the circuit board, and the body of the bare semiconductorchip 408 and the wiring pattern 406 are bonded. That is, the meltedthermoplastic resin coat 404 a filled between the bottom of the baresemiconductor chip 408 and the circuit board 407 is cooled andsolidified, and the bare semiconductor chip 408 and the circuit board407 are firmly bonded and fixed. Afterward, the bare semiconductor chip408 is sealed with resin by a well-known method if necessary and thepotting part 411 is formed.

Next, referring to FIGS. 9A-B, a procedure for mounting the electroniccomponent module 200 on the body of the data carrier 100 so that itsinsulating piece 201 crosses the orbital conductive flux 102 a composingthe curled conductive pattern 102 and electrically connecting with thecurled conductive pattern separately on the inside and the outside ofthe curled conductive pattern 102 will be described.

(Process A as Shown in FIG. 9A)

First, the electronic component module 200 is mounted on the body of thedata carrier 100 so that the electronic component mounted side of theelectronic component module 200 and the conductive pattern formationside of the body of the data carrier 100 are opposite, and theelectronic component module 200 crosses the orbital conductive flux 102a composing the curled conductive pattern 102. At this time, the pottingpart 411 covering the bare chip 408 which is an electronic component isinserted into the hole 307 made on the side of the body of the datacarrier 100. Further, the conductive resist areas 412 a and 412 b to beelectrode areas of a pair of aluminum foil areas 406 connected to thebumps 409 of the bare chip 408 on the side of the electronic componentmodule 200 are respectively located over a pair of conductive resistpatterns 305 a and 305 b on the side of the body of the data carrier100. That is, the copper foil areas 406 on the side of the electroniccomponent module 200 and the conductive resist patterns 305 a and 305 bon the side of the body of the data carrier 100 are respectivelyopposite via the conductive resist areas 412.

(Process B as Shown in FIG. 9B)

Next, indentators 501 a and 501 b heated up to 160° C. are pressedparticularly on a pair of conductive resist patterns 305 a and 305 b atthe pressure of 21.7 kg for 20 seconds from over the electroniccomponent module 200. At this time, the conductive resist pattern whichis a thermoplastic adhesive coat is locally softened and melted, and theconductive resist areas 412 a and 412 b that respectively conduct to theterminal areas 406 of the electronic component module 200 and theconductive resist patterns 305 a and 305 b on the side of the body ofthe data carrier 100 are respectively bonded and fixed. In the meantime,as the thermoplastic resin coat 404 a can be utilized for the junctionof the electronic component module 200 and the body of the data carrier100 with the thermoplastic resin coat keeping insulation. Further, theetching resist 304 on the surface of the curled conductive pattern 102is left as insulating material. Therefore, a wiring pattern (not shown)on the insulating base material piece 402 (201) of the electroniccomponent module 200 also functions as a jumper member mating the insideand the outside of the curled conductive pattern 102. As a result, thecurled conductive pattern 102 and the bare chip 408 can be electricallyconnected without using a jumper member, a back wiring pattern andothers as in related art type structure.

Next, referring to FIGS. 10A to 12B, another embodiment of the datacarrier manufacturing method according to the invention will bedescribed. This data carrier also functions as a flight tag, a label forphysical distribution management, a ticket for an unmanned wicket andothers and can also read an electromagnetic wave. This data carrier isalso composed by integrating the body of a data carrier with electroniccomponent module on the surface of the thin resin base material as inthe embodiment described referring to FIG. 5. In the body of a datacarrier, a metallic foil pattern composing an antenna coil is held onthin resin base material. In the electronic component module, a baresemiconductor chip composing a send and receive circuit, a memory andothers is mounted on an aluminum foil wiring pattern.

An example of the manufacturing process of the curled conductive pattern102 shown in FIG. 5 composing an antenna coil is shown in FIGS. 10A-C.Referring to FIGS. 10A-C, processes when the curled conductive pattern102 shown in FIG. 5 to be an antenna coil is formed on the single sideof the PET film base material 101 as shown in FIG. 5 will be describedbelow.

(Process A as Shown in FIG. 10A)

First, Cu-PET lamination base material 601 is prepared. For example,copper foil having the thickness of 10 μm is laminated on the singleside of a PET film having the thickness of 25 μm via an urethaneadhesive and is thermically bonded under a condition of the temperatureof 150° C. and the pressure of 5 kg/cm². Hereby, the Cu-PET lamination601 in which the cupper foil 603 is bonded on the surface of the PETfilm 602 (101) is completed.

(Process B as Shown in FIG. 10B)

Next, a curled etching resist pattern 604 and an etching resist pattern604 in the shape of a terminal are formed on the surface of the copperfoil 603 of the Cu-PET lamination 601. That is, insulating etchingresist ink is printed on the copper foil using an offset printing methodfor example so that the insulating etching resist ink has a curled shapehaving the number of turns, the width, the pitch and the inside andoutside circumferences for acquiring an L value and a Q valuerespectively required for the characteristics of a coil. For the resistink at this time, a type hardened by heat or an active energy beam isused. For the active energy beam, ultraviolet rays or an electron beamis used and in case ultraviolet rays are used. In this case, the resistink including a photopolymerization agent is used.

(Process C as Shown in FIG. 10C)

A curled conductive pattern 605 and terminal pads 606 a and 606 b on theinside and outside circumferences respectively composing an antenna coilare formed by removing a copper foil part 603 a exposed from the etchingresist pattern 604 formed in the above-mentioned process by well-knownetching. In this etching processing, FeCl₂ (120 g/l) is used for etchantunder a condition of the temperature of 50° C. and the required copperfoil (Cu) is removed.

Afterward, generally, unless the insulating etching resist 604 formed inthe process B is removed, an electronic component cannot be mounted on acircuit, that is, on a coil. In the invention, however, as the etchingresist located in parts to be bonded 606 a and 606 b is removed bymechanical friction by an ultrasonic wave injunction described later,the insulating resist 604 is not required to be removed. That is,according to the invention, a process for peeling the etching resist 604can be omitted. Further, effect is acquired such that the etching resist604 can be used for an insulating protective layer on the surface of thecopper conductive pattern 605.

Next, an example of a process for producing the electronic componentmodule 200 is shown in FIGS. 11A-E.

[Metallic Foil Lamination Manufacturing Process (A)]

In this process, an Al-PET lamination 701 which is original material ofa thin circuit board is manufactured. For example, the Al-PET lamination701 is manufactured in a process for laminating hard aluminum foil 703having the thickness of 35 μm on the single side (the upper surface inFIGS. 11 A-E) of a PET film 702 having the thickness of 25 μm via anurethane adhesive and bonding them thermally under a condition of thetemperature of 150° C. and the pressure of 5 kg/cm².

[Etching Mask Printing Process (B)]

In this process, an etching resist pattern 704 in the shape of arequired wiring pattern is formed on the surface of the hard aluminumfoil 703 of the Al-PET lamination 701. For example, the resist pattern704 is formed by applying a polyolefin thermoplastic resin adhesive,which is melted at the temperature of approximately 150° C., on thesurface of the hard aluminum foil 703 by approximately 4 to 6 μm inthickness by a method such as gravure. It is desirable that thisthickness is varied according to the size and the shape of a bump of amounted bare chip.

[Etching Process (C)]

In this process, a wiring pattern 706 made of the hard aluminum foil 703is formed by removing an aluminum foil part 705 exposed from the etchingresist pattern 704 by well-known etching processing. For example, thewiring pattern 706 is formed by exposing the aluminum foil part 705exposed from the etching resist pattern 704 to NaOH (120 g/l) which isetchant under a condition of the temperature of 50° C. The wiringpattern 706 made of the hard aluminum foil 703 is formed on the surfaceof a circuit board 707 acquired in this etching process. The overallsurface of the wiring pattern 706 is covered with the polyolefinthermoplastic resin adhesive used for the etching resist pattern (anetching mask) 704. In other words, the surface of at least an electrodearea (an area to be connected with a bump of a bare semiconductor chipdescribed later) of the wiring pattern 706 is covered with athermoplastic resin coat 704 a.

[Ultrasonic mounting process (D)]

In this process, a bare semiconductor chip 708 is mounted on the circuitboard 707 applying an ultrasonic wave. This process includes: 1) asubprocess (a first subprocess) for pushing the melted thermoplasticresin coat 704 a aside by pressing a bump 709 of the bare semiconductorchip 708 on the melted thermoplastic resin coat 704 a in a state inwhich the thermoplastic resin coat 704 a covering an electrode area 710on the wiring pattern 706 is heated and melted applying an ultrasonicwave so as to bring the bump 709 into contact with the electrode area710; and 2) a subprocess (a second subprocess) for bonding the bump 709and the electrode area 710 in a state in which the bump 709 and theelectrode area 710 are contacted with each other by continuouslyapplying an ultrasonic wave.

The bare semiconductor chip 708 is composed as a so-called surfacemounting-type component. That is, the bare semiconductor chip 708 has abody which is 150 μm thick and the bump 709 which is a metallic terminalfor connection and protruded form the bottom of the bare semiconductorchip 708. In the first subprocess, the bump (made of gold for example)709 is pressed on the thermoplastic resin coat 704 a which is melted byheating at 150° C. applying an ultrasonic wave. Then, the meltedthermoplastic resin coat 704 a is pushed aside and removed from theposition of the end of the bump 709 by the ultrasonic vibration of thebump 709. Further, an oxide layer and others on the surface of thealuminum foil wiring pattern 706 are also mechanically removed by thevibration. As a result, the bump 709 and the electrode area 710 arecontacted with each other. In the second subprocess, afterward, the bump709 and the electrode area 710 of the wiring pattern 706 are furtherheated by frictional heat by the vibration, a metallic fused part inwhich atoms of gold are diffused in the aluminum foil is formed and thebonding of both by an ultrasonic wave is completed.

The first and second subprocesses are completed by applying ultrasonicvibration of the frequency of 63 kHz by approximately a few secondsunder the pressure of 0.2 kg/mm² for example after the baresemiconductor chip 708 is arranged in a predetermined position.

[Bonding process (E)]

In this process, the melted thermoplastic resin coat 704 a is hardenedagain by natural cooling or forced cooling by removing the heat of 150°C. applied to the circuit board, and the body of the bare semiconductorchip 708 and the wiring pattern 706 are bonded. That is, thethermoplastic resin coat 704 a in a melted state filled between thebottom of the bare semiconductor chip 708 and the circuit board 707 iscooled and solidified, and the bare semiconductor chip 708 and thecircuit board 707 are firmly bonded and fixed. Afterward, the baresemiconductor chip 708 is sealed with resin by a well-known method ifnecessary and a potting part 711 is formed. As a result, an electroniccomponent module 707 is completed.

Next, referring to FIGS. 12A-B, a process for mounting the electroniccomponent module 707 on the data carrier 607 and electrically connectingwith an antenna coil will be described. This process is executed usingultrasonic welding technology.

(Process A as Shown in FIG. 12A)

First, the electronic component module 707 is mounted on the body of thedata carrier 607 in a matched state that parts to be bonded 708 a and708 b on the side of the electronic component and terminal pads 606 aand 606 b which are parts to be bonded on the side of the body of thedata carrier are opposite.

(Process B as Shown in FIG. 12 B)

Next, a pair of indentators 801 and 802 that fall integrally are pressedover the parts to be bonded 708 a and 708 b of the electronic componentmodule 707 by time T (approximately 0.5 second) applying the ultrasonicvibration of applied pressure P (0.2 kg/mm²) and a frequency V (40 kHz).Reference numbers 803 and 804 denote anvils arranged opposite to theindentators 801 and 802.

Generally, welding is caused by bringing atoms at distance (a fewangstrom (Å)) at which attraction is exerted between atoms on thesurfaces of metals to be bonded and contacting with the surfaces withatoms on the overall surfaces orderly arrayed. However, normally, as thesurface of metal is covered with a thin superficial layer such as oxideand absorbed gas, the approach of clean metallic atoms under it isprevented and sufficient bonding power is not caused.

In this ultrasonic bonding method, the terminal of the electroniccomponent module and the terminal on the side of the antenna coil arebonded and fixed by removing a metallic superficial layer by ultrasonicvibration by the above-mentioned method, further activating thevibration of atoms and diffusing atoms.

Further, this method is based upon a principle that bonding is realizedby removing a metallic superficial layer by ultrasonic vibration asdescribed above and even if the bonding process is executed in a statein which insulating etching resist 704 formed on the terminal pads 606 aand 606 b of the conductive pattern is not peeled as shown in theprocess (B) in FIG. 12B, a sufficient electric and mechanical bondingcharacteristic is acquired between the side of the electronic componentmodule 707 and the side of the body of the data carrier 607. The thindata carrier DC (see FIG. 5) according to the invention is completed bythe processes described above.

In the above-mentioned embodiments, the plastic flow of metal is locallycaused corresponding to the protruded part by providing multipleirregularities corresponding to the shape of the fused part to the endface of the anvils 803 and 804 opposite to the indentators 801 and 802for example and in the meantime, adjusting the pressing time of theindentators 801 and 802 and resin layers exposed from a part from whicha metallic layer is removed can be fused by ultrasonic vibration.Particularly, as the mechanical bonding strength of the electroniccomponent module is particularly enhanced in case such fusion of metaland the fusion of resin are both used, the data carrier is effectivewhen it is often roughly handled as a flight tag and a label forphysical distribution management.

As the thin data carrier completed as described above uses anelectromagnetic field as a read medium, it can securely read data storedin the semiconductor chip apart by the distance of 100 to 1000 mmwithout being restricted by distance and a direction in reading so much,concretely without being restricted by the direction of reading.

The result of the moisture-proof test (at the temperature of 85° C. andat the humidity of 85%) of the thin data carrier manufactured in thisembodiment is shown in FIG. 13. As shown in FIG. 13, the variation ofcommunication distance after 250 hours elapse in the moisture-proof testis within ±10%. It is verified that for reliability on themoisture-proof of the connection of the bump, a sufficient value isacquired.

As clear from the description, according to the invention, thesemiconductor chip mounting method by the flip-chip connection method inwhich the semiconductor chip can be mounted on the circuit boardpromptly, electrically and mechanically securely and further, at a lowcost can be provided.

Also, according to the invention, the electromagnetic wave readable datacarrier manufacturing method in which the electromagnetic wave readabledata carrier that functions as a flight tag, a label for physicaldistribution management, a ticket for an unmanned wicket and others canbe produced at a low cost in a mass can be provided.

What is claimed is:
 1. An electromagnetic wave readable data carriercomprising: an electronic component module including a circuit board anda semiconductor chip mounted on the circuit board, said circuit boardhaving a wiring pattern with an electrode area and a thermoplastic resincoat covering the electrode area of the wiring pattern, saidsemiconductor chip having a bump at a side of the circuit board thereof,the bump of the semiconductor chip penetrating the thermoplastic resincoat and being ultrasonically bonded with the electrode area of thewiring pattern.
 2. The electromagnetic wave readable data carrieraccording to claim 1, further comprising: a body of a data carrierincluding an insulating base material and a conductive pattern held onthe insulating base material.
 3. The electromagnetic wave readable datacarrier according to claim 2, wherein the conductive pattern is curled.4. The electromagnetic wave readable data carrier according to claim 1,wherein the electromagnetic wave readable data carrier uses anelectromagnetic filed as a read medium.
 5. The electromagnetic wavereadable data carrier according to claim 1, wherein the electroniccomponent module is manufactured by a method comprising: heating andmelting the thermoplastic resin coat of the circuit board; pressing thebump of the semiconductor chip on the thus melted thermoplastic resincoat while applying an ultrasonic wave to the bump so that the bumppenetrates the incited thermoplastic resin coat and contacts theelectrode area; bonding the bump and the electrode area by continuouslyapplying the ultrasonic wave to the bump while the bump is in contactwith the electrode area; cooling and solidifying the meltedthermoplastic resin coat so as to securely mount the semiconductor chipto the circuit board.
 6. The electromagnetic wave readable data carrieraccording to claim 1, wherein the semiconductor chip is mounted at acorner of the circuit board.